3D-Micromac‘s microCELL TLS enables an ablation free process that its designed to provide the edge quality needed in volume manufacturing. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield for crystalline half cells. Simply by a laser induced temperature gradient, a crack is guided at up to 300mm/s through the cell. Without the usual ablation, no dust or crystal defects by re-molten silicon occur. The results are higher efficiency, higher mechanical strength and better performance in module aging tests at highly increased throughput.