27 Mar '16, 4pm

@CfmSbr @LakesPlace @chadw18

Large quantities of sodium hydroxide are used to remove the sawing damage on the silicon wafer surfaces. In some cases, potassium hydroxide is used instead. These caustic chemicals are dangerous to the eyes, lungs and skin. Corrosive chemicals like hydrochloric acid, sulfuric acid, nitric acid and hydrogen fluoride are used to remove impurities from and clean semiconductor materials. Toxic phosphine or arsine gas is used in the doping of the semiconductor material. Though these are used in small quantities, inadequate containment or accidental release poses occupational risks. Other chemicals used or produced in the doping process include phosphorous oxychloride, phosphorous trichloride, boron bromide and boron trichloride. Isopropyl alcohol is used to clean c-Si wafers. The surface of the wafer is oxidized to silicon dioxide to protect the solar cell. Lead is often used i...

Full article: http://solarindustrymag.com/online/issues/SI1309/FEAT_05_...

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